Your search returned 11 records. Click on the hyperlinks to view further details of Titles..
Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing
Year : 2003Volume number : 26Issue:02
Colloidal Processing Of Polymer Ceramic Nanocomposite Integral Capacitors(Article) Subject:
Barium Hexaferrite
Author:
Hitesh
Windlass
P.Markondeya
Raj
page:
100
-
105
The Effect Of Pulse Plating Parameters On Copper Plating Distribution Of Microvia Pcb Manufacture(Article) Subject:
Printed Circuit Board
Author:
K C
Yung
T.M
Yu
page:
106
-
109
Meniscus Coating: A Low-Cost Polymer Deposition Method For System -On-Package (Sop) Substrates(Article) Subject:
Low Cost
Author:
K
Bhattacharya
G. W
Moon
page:
110
-
114
A Multiple-Perspective Design Advirsory System For Use In The Layout Design Of Printed Circuit Board Assemblies(Article) Subject:
Design
Author:
Trevor
Bonfield
Martin
Barber
page:
115
-
122
Determination And Comparison Of Surface Mount Component Rework Cycle Times Of Manual And Fully Automated Robotic Rework Stations For Rework Technology Selection(Article) Subject:
Automated Pcba Rework
,
Cycle Time Comparison
Author:
Needet
Geren
page:
123
-
132
New Metrics And Scheduling Rules For Disassembly And Bulk Recycling(Article) Subject:
Discrete Event
,
Electronic Privacy
Author:
Julie Ann
Stuart
Vivi
Christina
page:
133
-
140
Electron Beam Lithography In Naoscale Fabrication: Recent Development(Article) Subject:
Direct Writing
Author:
Ampere A.
Tseng
page:
141
-
149
Highly Reliable Non-Conductive Adhesives For Flip Chip Csp Applications(Article) Subject:
Au Bump
Author:
Myung-Jin
Yim
page:
150
-
155
No-Flow Underfill Process Modeling And Analysis For Low Cost High Throughput Flip Chip Assembly(Article) Subject:
Analysis
,
Assembly
,
Chip Cards
Author:
Chunho
Kim
page:
156
-
165
A Study Coining Processes Of Solder Bumps On Organic Substrates(Article) Subject:
Coin Tap Test
Author:
Jae-Woong
Na
page:
166
-
172
Adhesive Evaluation On Low-Cost Alternatives To Thermosetting Epoxy Encapsulants(Article) Subject:
Adhesion
,
Encapsulant
Author:
Lianhua
Fan
page:
173
-
178